The PhD candidate will work on the design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based High Electron Mobility Transistors (HEMTs) including:
• Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and high power operation
• Synthesis of high thermal conductivity AlN and AlScN layers
• Integration of AlN and AlScN as interposers and heat dissipation layers
The research will be conducted at ISOM (www.isom.upm.es) and CEMDATIC (www.cemdatic.upm.es), Technical University of Madrid. The candidate will pursue an industrial PhD in a joint program with INDRA Sistemas S. A., a Spanish multinational company, within the project “Chair UPM-INDRA in Microelectronics”
WHAT WE OFFER
• Three-year contract. Annual gross salary of 25,350 € and health and social benefits according to Spanish law
• Excellent facilities, international atmosphere, and partnering with industry
WHAT WE NEED
• A Master degree in Electronic/Telecommunication/Materials Engineering or Physics
• Proficiency in English, goal-oriented mindset, creativity, teamwork & communication skills. Previous research experience will be highly valued
• Applicants should send a motivation letter & CV to both Marta Clement (marta.clement@upm.es) and Jorge Pedrós (j.pedros@upm.es)
Contact: Jorge Pedrós Ayala
Deadline: 30/06/2024
